TOKYO, Dec 20 (News On Japan) –
Rapidus President Koike has unveiled what the corporate says is the world’s first next-generation semiconductor substrate measuring 600 millimeters on both sides, marking a major step ahead for Japan’s rising chipmaker.
The newly developed substrate, which makes use of glass as its base materials, can accommodate and be reduce into greater than ten occasions the variety of AI-focused semiconductors in contrast with standard substrates, a function anticipated to dramatically enhance manufacturing effectivity.
Rapidus plans to additional advance the event of cost-competitive semiconductor substrates, with the goal of leveraging the know-how to safe main clients in 2026 as international demand for high-performance AI chips continues to broaden.
Source: テレ東BIZ