New Delhi [India], September 3 (ANI): The Government of Odisha signed two main Memorandums of Understanding (MoUs) value Rs. 2,655 crore on the opening day of SEMICON India 2025. As per an official press launch issued by the Government of Odisha, the MoUs have been inked on Tuesday with TopTrack Hi-Tech PCB, which can make investments Rs. 1,005 crore in a complicated printed circuit board (PCB) manufacturing facility, and Sancode Technologies Limited, which plans a Rs. 1,650 crore facility with assist from its international companions.
The Electronics & Information Technology (E&IT) Department of the Odisha authorities is collaborating in SEMICON India 2025, being held from September 2 to 4 at Yashobhoomi, New Delhi, by a devoted Odisha Pavilion.
Chief Minister Mohan Charan Majhi inaugurated the pavilion and was joined by senior officers, together with E&IT Minister Mukesh Mahaling, Chief Secretary Manoj Ahuja, Principal Secretary Vishal Dev, and Special Secretary Manas Ranjan Panda.
Speaking on the event, the Chief Minister stated, ‘Aligned with the Hon’ble Prime Minister’s imaginative and prescient, Odisha is dedicated to turning into a powerhouse in India’s electronics and semiconductor journey. It is a matter of immense satisfaction for us that our establishments, NIT Rourkela and PMEC Berhampur, have performed a vital function within the first Made-in-India chip, showcasing the extraordinary expertise and innovation nurtured in our state.’
On the sidelines of the occasion, the Chief Minister held high-level conferences with international semiconductor firms. RIR Power Electronics briefed him on its upcoming SiC wafer fabrication facility, anticipated to start industrial manufacturing in March 2026.
India’s first Integrated Device Manufacturing (IDM) facility for SiC-based compound semiconductors. SicSem Pvt. Ltd. has emerged as a landmark funding value Rs. 2,067 crore.
An superior packaging 3D glass packaging unit by 3D Glass Solutions Inc., with a proposed funding of Rs. 1,944 crore
The Odisha management additionally engaged with Western Digital, Renesas, NXP Semiconductors, Siemens, and Micron, who confirmed curiosity in expertise collaborations with IIT Bhubaneswar and different establishments. Ajit Manocha, President and CEO of SEMI, praised Odisha’s semiconductor insurance policies and invited the Chief Minister to Semicon Japan later this 12 months.
To speed up development, the state has launched two new insurance policies, the Electronics Component Manufacturing (ECM) Policy 2025 and the Odisha Semiconductor Manufacturing & Fabless Policy 2025. Both intention to draw funding throughout the electronics worth chain with profitable incentives and single-window clearances. (ANI)