HomeLatestNext-Gen Semiconductor Project Kicks Off in Hokkaido

Next-Gen Semiconductor Project Kicks Off in Hokkaido

HOKKAIDO, Apr 02 (News On Japan) –
The prototype line for next-generation semiconductors developed by Rapidus is now prepared, as a nationwide initiative to spice up Japan’s chip business takes a significant step ahead in Hokkaido.

Rapidus, aiming to mass-produce cutting-edge semiconductors, has accomplished preparations for a prototype line at its manufacturing facility in Chitose, Hokkaido. The aim is to start mass manufacturing by 2027 of chips with circuit line widths on the 2-nanometer scale—among the many most superior on this planet.

“We’ve reached a key point where we can begin prototyping, having overcome major technological hurdles. What lies ahead will be even more important,” stated Rapidus President Koike Atsuyoshi.

With this government-backed challenge absolutely underway, Hokkaido is rising as a hub for Japan’s semiconductor revival.

Source: 北海道ニュースUHB

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