Taiyo Holdings Co., Ltd., headquartered in Tokyo, has launched the ‘FPIM Series,’ a next-generation semiconductor-packaging materials offered on the IEEE Electronics System-Integration Technology Conference (ESTC 2026) in Helsinki, Finland. The FPIM Series represents a big development in semiconductor expertise, attaining the primary three-layer redistribution layer (RDL) formation with a 700-nm important dimension (CD) on 12-inch wafers.
The new materials, a fine-pitch RDL negative-tone i-line photosensitive insulating product, is designed for twin damascene processes. Co-authored by imec, a number one semiconductor analysis institute, the paper highlights the Material’s capability to assist more and more fine-pitch wiring, important for contemporary semiconductor-packaging buildings.
This collaboration with imec started in October 2022, and vital progress was made by November 2025, with a co-authored paper detailing the creation of a three-layer RDL construction attaining a 1.6-micrometer CD on 12-inch wafers.
The carried out analysis confirmed the FPIM Series attaining a 700-nm CD for interconnects and vias. The 700-nm CD steel 1 layer demonstrated wonderful electrical traits, resembling low leakage present and resistance, confirming the Material’s suitability for the chemical mechanical planarization (CMP) course of. These developments mark a big step ahead in next-generation interconnect expertise for superior packaging purposes.
Looking forward, Taiyo Holdings goals to develop applied sciences that obtain RDL formation with a CD of 500 nm or much less. This objective entails verifying long-term efficiency and reliability whereas advancing the event of supplies that improve semiconductor packaging, particularly for AI semiconductor efficiency enhancements. By 2025, Taiyo Holdings started supplying small-volume samples of the FPIM Series for R&D functions.
The collaboration between imec and Taiyo Holdings underscores a dedication to innovation in semiconductor expertise. Imec, headquartered in Belgium, fosters collaboration with universities and firms worldwide in cutting-edge semiconductor analysis. Since October 2022, personnel from Taiyo Holdings have been stationed at imec to facilitate ongoing joint analysis on semiconductor supplies, together with fine-pitch RDL supplies for damascene processes.