Floadia Corporation has launched its newest automotive embedded flash IP, G1, developed on TSMC’s 180BCD Gen3 course of platform. The new IP goals to fulfill the demanding reliability and efficiency requirements required for next-generation automotive functions.
The G1 automotive eFlash IP integrates a 256KB program flash macro and a 1KB information flash macro using SONOS expertise. This gives a sturdy and cost-efficient non-volatile reminiscence answer for automotive built-in circuits (ICs). Notably, the G1 eFlash course of is included atop TSMC’s normal 180BCD Gen3 platform with out modifying the unique course of design package (PDK). This permits purchasers to make use of the prevailing certified PDK whereas simply integrating embedded flash into their designs. The IP has efficiently accomplished AEC-Q100 Grade 1 full qualification on TSMC 180BCD Gen3, thereby confirming its resilience underneath extreme automotive working situations and indicating its manufacturing readiness.
The eFlash IP contains a 256KB program flash (PFlash) for code storage, alongside a 1KB information flash (DFlash) that boasts 100K program/erase endurance, delivering EEPROM-like performance for information storage. Both PFlash and DFlash are optimized for fast operation, attaining a most erase time of lower than 20 milliseconds. This enhances system efficiency and reduces firmware replace time in automotive techniques.
To facilitate system integration, the G1 eFlash IP contains an inner cost pump, eliminating the need for exterior high-voltage circuitry. Additionally, each PFlash and DFlash are fitted with an 8 parity-bit code for ECC interface to make sure excessive information integrity and reliability over the machine’s lifetime.
With its established SONOS-based structure, swift erase efficiency, and complete automotive qualification, Floadia’s G1 eFlash IP on TSMC 180BCD Gen3 is suited to a broad array of automotive functions. These embrace energy administration ICs, motor drivers, physique electronics, and different automotive techniques.